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ARJ2203 Datasheet(PDF) 4 Page - Nais(Matsushita Electric Works)

Part # ARJ2203
Description  SMD RELAYS WITH 8GHz CAPABILITIES
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Manufacturer  NAIS [Nais(Matsushita Electric Works)]
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Logo NAIS - Nais(Matsushita Electric Works)

ARJ2203 Datasheet(HTML) 4 Page - Nais(Matsushita Electric Works)

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RJ(ARJ2)
5
NOTES
1. Coil operating power
Pure DC current should be applied to the
coil.The wave form should be rectangular.
If it includes ripple, the ripple factor should
be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different. The nominal operating voltage
should be applied to the coil for more than
20 ms to set/reset the latching type relay.
2. Coil connection
When connecting coils, refer to the wiring
diagram to prevent mis-operation or mal-
function.
3. External magnetic field
Since RJ relays are highly sensitive polar-
ized relays, their characteristics will be af-
fected by a strong external magnetic field.
Avoid using the relay under that condition.
4. Cleaning
For automatic cleaning, the boiling meth-
od is recommended. Avoid ultrasonic
cleaning which subjects the relays to high
frequency vibrations, which may cause
the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Tape and reel packing
1) Tape dimensions
2) Dimensions of plastic reel
6. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and at-
mospheric pressure during usage, trans-
port, and storage of the relay:
(1) Temperature:
–30 to +70
°C –22 to +158°F
(However, tolerance range is –30 to
+60
°C –22 to +140°F if package is carried
as is.)
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the tem-
perature. Use within the range indicated
in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for us-
age, transport, and storage:
2) Condensation
Condensation forms when there is a sud-
den change in temperature under high
temperature and high humidity conditions.
Condensation will cause deterioration of
the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0
°C 32°F. This causes prob-
lems such as sticking of movable parts or
operational time lags.
4) Low temperature, low humidity environ-
ments
The plastic becomes brittle if the relay is
exposed to a low temperature, low humid-
ity environment for long periods of time.
5) Storage procedures for surface-mount
terminal types
Since the relay is very sensitive to humid-
ity, it is packed in humidity-free, hermeti-
cally sealed packaging. When storing the
relay, be careful of the following points:
(1) Be sure to use the relay immediately
after removing it from its sealed package.
(2) When storing the relay for long periods
of time after removing it from its sealed
package, we recommend using a humidi-
ty-free bag with silica gel to prevent sub-
jecting the relay to humidity.
Furthermore, if the relay is solder mount-
ed when it has been subjected to exces-
sive humidity, cracks and leaks can occur.
Be sure to mount the relay under the re-
quired mounting conditions.
7. Soldering
1) Surface-mount terminal
In case of automatic soldering, the follow-
ing conditions should be observed
(1) Position of measuring temperature
(2) IR (infrared reflow) soldering method
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and the
top surface of the relay case not to exceed
the above mentioned soldering condition.
It is recommended to check the tempera-
ture rise of each portion under actual
mounting condition before use.
2) Standard PC board terminal
Please meet the following conditions if
this relay is to be automatically soldered.
(1) Preheating: Max. 100
°C 212°F (termi-
nal solder surface) for max. 60 seconds
(2) Soldering: Max. 250
°C 482°F for max.
5 seconds
The effect on the relay depends on the ac-
tual substrate used. Please verify the sub-
strate to be used.
3) Hand soldering
Please meet the following conditions if
this relay is to be soldered by hand.
(1) Wattage: 30 to 60 W
(2) Tip temperature/time: 280 to 300
°C
536 to 572
°F for max. 5 seconds
The effect on the relay depends on the ac-
tual substrate used. Please verify the sub-
strate to be used.
4) Avoid high frequency cleaning since
this may adversely affect relay character-
istics. Use alcohol-based cleaning solu-
tions when cleaning relays.
3 to
11.40
.449
9.40
.370
1.33
.052
2.57
.101
6.20
.244
4.00 .157
(Accumulation 10 pitch:
40
±0.1 1.575±.004)
16.00
.630
2.0
.079
8.50
.337
8.80
.346
0.40
±0.05
.016
±.002
11.20
.441
1.50
.059
7.40
.291
1.75
.069
14.40
.570
16.00
.630
11.50
.453
(10.75)
(.423)
24.00
.945
21
±0.8 dia.
.827
±.031 dia.
13
±0.2 dia.
.512
±.008 dia.
24.4
.961
+2
0
+.079
0
100
±1 dia.
3.937
±.039 dia.
2.0
±0.2
.079
±.008
370
±2 dia.
14.567
±.079 dia.
2.0
±0.5
.079
±.020
Temperature,
°C °F
85
5
0
32
70
158
–30
–22
(Avoid
condensation
when used at
temperatures
higher than
0
°C 32°F)
Humidity, %R.H.
Tolerance range
(Avoid freezing
when used at
temperatures
lower than
0
°C 32°F)
B
1.0mm .039inch
A: Surface of PC board where relay is mounted.
B: Above the PC board surface.
A
T1
T2
T3
T4
T5
t1
t3 t4 t5
t2
A:
B:
t2 - t1 = 80 to 120 s
t5 - t3 = 30 to 40 s
t4 = 170 to 190 s
T1=150
°C 302°F
T2=160
°C 320°F
T3=183
°C 361°F
T4=245
°C 473°F
T5=270
°C 518°F
rj.fm
5
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