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VND7012AY-E Datasheet(PDF) 37 Page - STMicroelectronics |
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VND7012AY-E Datasheet(HTML) 37 Page - STMicroelectronics |
37 / 46 page DocID022886 Rev 6 37/46 VND7012AY-E Package and PCB thermal data Figure 39. Rthj-amb vs PCB copper area in open box free air condition (one channel on) Table 14. PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 129 mm x 86 mm Board material FR4 Cu thickness (outer layers) 0.070 mm Cu thickness (inner layers) 0.035 mm Thermal via separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Cu thickness on vias 0.025 mm Footprint dimension 4.1 mm x 6.5 mm |
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